Abstract
In present study, the formability of Ni-based CMH1, Ni-Fe-based CMH2, and Fe-based CMH3 has been evaluated by the Gleeble-3500 thermo-mechanical simulator with the assistance of CALPHAD-base Jmatpro and Deform-3D simulation software. The effect of 100 ppm yttrium addition on the properties of interconnect application in SOFCs has been assessed for SCY1, SCY2, and SCY3. In addition, grain boundary engineering (GBE) has been applied to CMH3 to enhance the high temperature properties. Meanwhile, the effect of GBE on the properties of interconnect application in SOFCs has been analyzed. The properties of interconnect application in SOFCs in this study include the oxidation resistance, area specific resistance (ASR), coefficient of thermal expansion (CTE), and Cr evaporation test at 800°C. Research results indicate that the formability of CMH2 and CMH3 is good while the formability of CMH1 is bad. The addition of 100 ppm yttrium can enhance the oxidation resistance and electrical resistance for SCY1, SCY2, and SCY3. With the addition of yttrium, the Cr evaporation rate has been reduced for SCY1 and SCY3 while the Cr has evaporated more severely in SCY2. There is no difference in the coefficient of thermal expansion with the addition of yttrium. On the other hand, GBE-processed specimens (RX2 and STA1) have shown better oxidation resistance and lower ASR values in comparison to CMH3. The Cr evaporation rate for RX2 is lower while for STA1 is higher compared to CMH3. The oxidation weight change should be evaluated in company with the degree of Cr evaporation. Similarly, the thermal expansion behavior for CMH3, RX2, and STA1 has shown no difference.