Abstract
Notebook heat dissipation technique(s) has always been a subject with continuous research and development needs. The necessity to improve existing methods of heat dissipation and develop new dissipation techniques, is particularly important in the face of improved electronic circuitry efficiencies. In this regard, the objective of the present thesis is to investigate and discuss the appropriate use of Applied Numeric Analysis software for the purposes of understanding how and under what conditions heat dissipation occurs, in order to achieve improvements in current heat dissipation techniques, and to attain ideal CPU temperature and internal systems heat control. We began our study by first using the Flotherm 2.2 simulation software to provide a basic internal notebook systems thermal analysis. Results of this initial simulation was used to analyze current and systems heat flows, which served as the basis for our recommendations to improve existing heat dissipation techniques such as the elimination of heat pools, and the enhancement of heat sink and ventilation fan designs. The recommendations were then used for the design of an improved heat dissipation method that increases per unit volume CPU heat dissipation efficiency by three times the original, while maintaining the same internal systems maximum temperature. Making comparisons between the initial laptop internal systems analysis and analysis using recommended heat dissipation techniques, we have arrived at the following conclusions and recommendations: 1.Considerations were given to the placement and direction of the ventilation fans: Recommendations were given to placing ventilation fans around high temperature areas in the heat sink, and the redesign of existing heat sinks with considerations given to fan air flow. Simulation comparisons revealed that identical CPU parts had a peak temperature decrease of approximately 27°C. 2.Consideration was given to the aggregation of heat pools that result from convection currents above heat sinks: Recommendations were given to the design of duct style heat sinks, and the use of forced convection within the ducts. Simulation comparisons revealed that, depending on the number of ducts used, there was a 1.0°C to 3.5 °C improvement in internal temperature reduction. 3.Consideration was given to the reduced ventilation air flow speed as a result of the duct placement: Recommendations were given to placing the heat sinks external to the ducts to allow for heat dissipation using natural convection methods. Simulation comparisons revealed that there was a 6°C improvement in internal temperature reduction. 4.Considerations were given to the use of copper versus duraluminum due to the better thermal conductivity of copper (2.5x of duraluminum). Consideration was also given to additional assembly requirements of copper. Recommendation was given to the use of copper CPU chips within the ducts. Simulation analysis revealed that there was a 17°C improvement in internal temperature reduction. 5.Consideration was given to the singular air current flow that may result in heavy pressures on the ventilation system. Recommendation was given to the use of dual duct heat sinks. Simulation comparisons revealed that there was a 12.4°C improvement in internal temperature reduction.