Feasibility Study on Modified Anand model for Failure assessment of SAC Solder Joints in Electronic packages

Thesis

Ramachandran, Velsankar

Masters, 國立清華大學, 動力機械工程學系

2016

Abstract

晶圓級晶片尺寸封裝

限單元素模擬法

加速熱循環

Modified-Anand模型

WLCSP

Primary Creep

Accelerated Thermal Cycling

Anand Model

Finite element

Strain rate effect

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Title: Feasibility Study on Modified Anand model for Failure assessment of SAC Solder Joints in Electronic packages
Translated title: Feasibility Study on Modified Anand model for Failure assessment of SAC Solder Joints in Electronic packages
Creators: Ramachandran, Velsankar
Contributors: Chiang, Kuo-Ning (Advisor)
Awarding Institution: 國立清華大學, 動力機械工程學系; Masters
Theses and Dissertations: Masters, 國立清華大學, 動力機械工程學系
Language: English
Resource Type: Thesis
Date published: 2017