Flip-Chip Bonding Testing and Applying for 960*540 Micro Light Emitting Diode Array

Thesis

Su, Yu-Heng.

Masters, 國立清華大學, 電子工程研究所

2016

Abstract

覆晶封裝

微型發光二極體陣列

Flip chip bonding

Micro LED array

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Title: Flip-Chip Bonding Testing and Applying for 960*540 Micro Light Emitting Diode Array
Translated title: Flip-Chip Bonding Testing and Applying for 960*540 Micro Light Emitting Diode Array
Creators: Su, Yu-Heng.
Contributors: Wu, Meng-Chyi (Advisor)
Hsu, Tzu-Chieh (Advisor)
Awarding Institution: 國立清華大學, 電子工程研究所; Masters
Theses and Dissertations: Masters, 國立清華大學, 電子工程研究所
Language: English
Resource Type: Thesis
Date published: 2017