Abstract
As the integrated circuit industry continues to scale down the minimun feature size, design style is moving from complex 2D design to highly regular 1D design with the "lines and cuts" process. While dense lines can be fully optimized by their regularity, randomly distributed cuts become a major challenge for the fabrication of 1D layout. In this thesis, we consider a hybrid lithography process combining directed self-assembly (DSA) and E-Beam for 1D gridded layout, and present a cut redistribution algorithm to maximize the number of cuts matched with DSA templates and minimize the number of cuts printed by E-Beam. The robustness of our algorithm is demonstrated through encouraging experimental results.