Abstract
The inspect item of this research is DIP IC components which had formed leads and marked characters, make use of image process to inspect ink patterns printed on it. Same as the IC outline packaging, ink printed pattern gives user to identify the function, we can depend on all of the IC's outline to judging properties and usages etc. Focus on marking patterns, this thesis introduced a lot of image alignment methods, and then other marking defect inspection methods. Image alignment, emphasis on locations of the alignment point, can be divided to line fitting and point fitting two parts. Line fitting's alignment points usually base on contour of the object, like IC mold's contour line fitting. On the other hand, Point fitting's alignment point is calculated on one area, like centroid of the object, or correlation searching for the highest matching point. Marking defect inspection, this research bring in three inspect methods, and different defect components have different inspect manners, thus according to marking manners and industry's suggestions to define new IC marking defect components, from that to develop proper IC marking defect inspection system, substitute labor and become a tendency.