Abstract
以Sessile drop方法來測量於空氣中Ag-Sn 及In-Sn 兩合金系之表面張力, 并以面積擴展, 實際來獲得In-Ag-Sn三成分合金系中潤濕能力最好的組成。并將此成分在純銅基材上以及在鍍金、銀、鎳、錫之銅基材上比較其面積擴展能力及黏合強度。
- Title
- In-Ag-Sn合金系在半導體六件之焊接研究
- Translated title
- In-Ag-Sn合金系在半導體六件之焊接研究
- Creators
- 王廷熏 (Author)
- Contributors
- 謝正雄陳建瑞 (Advisor)
- Awarding Institution
- National Tsing Hua University; Masters
- Theses and Dissertations
- Masters, National Tsing Hua University
- Resource Type
- Thesis
- Language
- English