Interfacial reactions of Ni3Sn4 intermetallic compound in Ni/SnAg/Ni structure under thermomigration

Thesis

Yang, Yi Shan

Masters, 國立清華大學, 工程與系統科學系

2014

Abstract

熱遷移

鎳

焊錫

界面反應

溫度梯度

介金屬化合物

thermomigration

solder

Interfacial reaction

temperature gradient

Ni3Sn4

因申請專利緣故，資料延後公開

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Title: Interfacial reactions of Ni3Sn4 intermetallic compound in Ni/SnAg/Ni structure under thermomigration
Translated title: Interfacial reactions of Ni3Sn4 intermetallic compound in Ni/SnAg/Ni structure under thermomigration
Creators: Yang, Yi Shan
Contributors: Ouyang, Fan Yi (Advisor)
Awarding Institution: 國立清華大學, 工程與系統科學系; Masters
Theses and Dissertations: Masters, 國立清華大學, 工程與系統科學系
Language: English
Resource Type: Thesis
Date published: 2015