Abstract
In this study we successfully to demonstrate the silver-nanoparticles-catalyzed chemical reaction wet-etching for commercialize, single-side polished, orientation with (100) face, and 4-inch with diameter silicon wafers with regular and around 1、2、3-μm uniform depth surface large-scale patterned nanowires surrounding the Al-metal heating resistor with 20 μm width and 300 nm thickness by the sputter and lift-off process. After that by the investigation of micro-Raman spectroscopy we directly proved the reduction of thermal stress near the sidewall area between substrate silicon and heating resistor which operating with high power density. By the result of this study we may prove the high density surface nanostructure can enhance the reliability of electronic devices. Keywords：Metal-Catalyzed Wet-Etching、Raman Spectroscopy、Thermal Stress Reduction