Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules

Thesis

Hsu, Tzu Yu

Masters, 國立清華大學, 工程與系統科學系

2014

Abstract

銀合金打線

電遷移

Ag-alloyed wire bond

electromigration

因申請專利緣故，資料延後公開

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Title: Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
Translated title: Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
Creators: Hsu, Tzu Yu
Contributors: Ouyang, Fan Yi (Advisor)
Awarding Institution: 國立清華大學, 工程與系統科學系; Masters
Theses and Dissertations: Masters, 國立清華大學, 工程與系統科學系
Language: English
Resource Type: Thesis
Date published: 2015