Abstract
In current technology, wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. In this thesis, we study a pad assignment problem which assigns inter-die signals to die pads so as to facilitate wire bonding. It is an important physical design problem because the quality of a pad assignment solution affects both the cost and performance of a SiP design. We propose a pad assignment approach which modifies an existing network based algorithm and aims to minimize the total signal wirelength without illegal crossings. For any three-die problem instance, we show that our approach can always find a feasible solution. The experimental results show that our approach can efficiently produce solutions of better quality as compared with a state-of-the-art work. Besides, we also extend the pad assignment problem by considering practical design constraints, and describe how to modify our approach to handle these constraints.