Abstract
Block copolymer directed self-assembly (DSA) has emerged as an economical complementary technology in the midst of next generation lithography. In particular, DSA has a strong potential for contact hole and via patterning. However, high via density in sub-10nm technology node makes it very hard to manufacture all the vias using DSA only. Complementing DSA with multiple patterning (MP) is an option such that multiple masks are used to print the DSA guiding templates for guiding the self-assembly of the block copolymer. Besides, redundant via insertion is desirable because it is an effective means to reduce yield loss due to via defect and improve reliability. To the best of our knowledge, we are the first work to consider DSA-MP decomposition and redundant via insertion with dummy via consideration to enhance manufacturability. Experimental results shows the effectiveness and efficiency of our method compared with previous works and resulted in 0 unmanufacturable vias for all benchmarks.