Abstract
AbstractThe reliable material property of device layer on SOI wafer is suitable for fabricating micro devices, but the current proposed processes of SOI wafer are too simple to manufacture devices with various functionalities. On the contrary, the surface micromachining is good at achieving complicated design; but the residual stress of thin film destroys devices. Combining the individual advantages of SOI wafer and surface micromachining, an integration process is established by trench-refilled technology in the thesis.The microoptical bench with the proposed integration process is comprised of micro optical device, some hinges and latches on a comb-drive micro bench. By decoupling the functionalities of actuator and passive optical device, the performance of the two components will be significantly improved.The proposed microoptical bench provides active light modulation with actuator, which is capable of increasing the applications of microoptical bench. Besides, the fabricated high-aspect-ratio actuators with single crystal silicon have excellent performance in reliability and stability. Furthermore, the surface micromachining is able to fabricate various optical devices, hinges and latches for integrating with micro bench. Therefore, the proposed microoptical bench is potential in optical applications.