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Study of Improving Cooling Capacity of High Power 808nm Laser Diode Package
Thesis

Study of Improving Cooling Capacity of High Power 808nm Laser Diode Package

Tseng, Chih Yao
Masters, 國立清華大學, 電子工程研究所
2014

Abstract

雷射二極體 雷射封裝 半導體接面溫度 熱傳導 Laser Diode Laser Packaging Junction Temperature Heat Conduction
In this study, the cooling capacity improvement of high-power 808nm laser diode package is the topic. Find effective ways to reduce the package laser diode temperature and waste heat using oil cooling solution that high-voltage transformer uses commonly, as well as improved CS-mount package in order to increase the thermal conduction path of laser diodes to achieve better cooling effect. And the temperature measurement of laser diodes used the red shift of laser optical spectrum, which is in order to assess the thermal capability of package is improvable. Finally, integrate two kinds of cooling solutions in a complete package and discuss all of the above. After a series of experiments to confirm the oil cooling can effectively reduce the temperature of the laser diode and enhanced laser optical power after fiber-coupling. The center CS-mount also can reduce the thermal resistance of package about 1.32 times for achieving heat dissipation effectively. After the integration of the above two methods, the laser can be operated in QCW mode to 14A optical power about 12W, and operate in CW mode to 10A optical power about 4.5W, whereas the measured thermal resistance is also similar with the simulated thermal resistance.

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