The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer

Thesis

Lin, Yu Fang

Masters, 國立清華大學, 工程與系統科學系

2015

Abstract

銀三錫

熱遷移

無鉛焊錫

介金屬化合物

銅原子流量

Ag3Sn

thermomigration

lead free solder

intermetallic compound

Cu flux

因申請專利緣故，資料延後公開

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Title: The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer
Translated title: The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer
Creators: Lin, Yu Fang
Contributors: Ouyang, Fan Yi (Advisor)
Awarding Institution: 國立清華大學, 工程與系統科學系; Masters
Theses and Dissertations: Masters, 國立清華大學, 工程與系統科學系
Language: English
Resource Type: Thesis
Date published: 2016