Abstract
A major cause of manufacturing problems in plastic ball grid array (PBGA) is substrate warpage. In general, the main PBGA manufacturing processes include the die attaching, the wire bonding, the transfer molding and the solder reflow. In the past few years, it was found that the transfer molding and the infrared (IR) solder reflow processes are the key factors for causing the warpage of PBGA. In this research, the parametric analysis of warpage of PBGA package in transfer molding and solder reflow processes is studied. The design parameters considered in the parametric analysis include the thickness and area of the die, die attach, molding compound and BT-substrate. Furthermore, the molding compound material and the die attach material are also taken as design parameters. The results from these analyses could be considered as a design guideline for PBGA package warpage control.