Abstract
Due to the decrease of life cycle and time to market of the electrical products, the suppliers have to provide not only all kinds of inspection instruments but have to meet the customers's need in the shortest time. The former design of burn-in socket is usually for single package only. IC designers could not examine their samples immediately and effectively during the design period. Also, it will lead to high cost of their designs and lack of competitiveness.In order to solve this problem, one may either standardize the I/O specification or design a new type of burn-in socket to adapt to ICs with different dimensions. However, it is an unnecessary restriction to the designers to make the ball pitch unique. For this reason, it is most likely to design a new universal burn-in socket.This research proposed a socket, which can adjust itself to test the IC of different size or/and different footprint. By the design, we hope that we can minimize the period of design or time to market, and we would promote the manufacturers’ international competitiveness in IC testing equipment eventually. Following work will be finished to achieve to goal listed above: 1. Design a new socket. 2. Optimized the new design. 3. Manufacture the design. 4. Use the socket to test the IC produced by this project, the reliability of the socket is also tested and analyzed.