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二維等向預應變微影技術
Thesis

二維等向預應變微影技術

洪建瑋
Masters, 國立清華大學, 動力機械工程學系
2014

Abstract

彈性基板 機械拉伸 圖樣微縮 預應變 半導體製程 Elastic substrate mechanical stretching pattern modification pre-strain semiconductor process
This research proposed a ring-shape mechanical clamp to provide 360° isotropic strain on the xy-plane onto an elastic substrate to modify the patterns above it after lithography. By applying the 200μm-thick PDMS substrate 10%, 20%, and 40% isotropic strain followed by 10nm thick Ag pattering by lithography, the patterns showed 17%, 30%, and 49% area reduction respectively. Compared with their respective 17.4%, 30.6%, and 49%theoretical reduction, the research showed identical theory, simulation, and experimental works. This research improved the impracticality of the previous one-dimensional pre-strain lithography on the xy-plane. The results not only showed expected area reduction, but also showed the independency of size, location, and orientation of the pattern. The results implied that pattern size reduction of lithography can be realized without changing the facilities, parameters, and materials.

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