Abstract
This study reports a novel tensile testing platform for MEMS thin films by microfabrication. Due to ‘nominally-clamped’ boundary from microfabrication, the boundary exists extra moment leading to out-of-plane deflection which is a disadvantage for MEMS designers. This study primarily changes that innate disadvantage to an advantage that can measure the out-of-plane deflection precisely by WYKO sub-nano scale measurement. We transform the weak point to the strong point to get the thin films mechanical properties precisely. Besides, we assemble the force gauge to improve the stiffness of tensile chips in order to stretch smoothly. Finally, the parylene passivation technique allows the users to change the specimens without limiting by fabrication. This chip consists of specimens, supporting springs modules and connection modules. According to user’s concerns, they can construct their own modules and extract material properties .