Abstract
Abstract In order to reduce the contact thermal resistance between Cooler and CPU surface, the Thermal Interface Material (T.I.M.) is necessary to fill the gap interface and also enhance heat transfer. The main purpose of this paper was to discuss the experimental methods conducted with using different size of aluminum nitride and boron nitride and aluminum powder to fill the thermal paste and thermal film, the effect of thermal conductivity caused by the method was also evaluated in this study. This study includes four major methods; The first part was the stability analysis on T.I.M. measuring system. The second part was research and development of the Thermal Pad, the third part was research and development of the Thermal Grease, and final part was the Dummy Heater performance testing for the system thermal resistance. Experiment results shown the accuracy error was below 8% for TIM measuring system by using the Dow Corning TC-5121, and Shin-Etsu 7762 as the test sample. In Thermal Pad measurement, the results shown the accuracy error within 9% in thermal conductivity compare with the data provided by SAINT- GOBAIN Advanced Materials Company. As for the Thermal Pad experiment, it could reach 2.17 (W/m˙K) when using aluminum and aluminum nitride at 75wt%. As for the Thermal Grease experiment, it is good for thermal conductivity and pressure but melt in water easily, so it is difficaut to use now. Key words: thermal interface material, thermal conductivity, Thermal Grease, Thermal Pad.