Abstract
To enhance efficiency of heat transfer, fill the gap interface and reduce the thermal resistance between Cooler and CPU surface, the Thermal Interface Material (TIM) was made. The main purpose of this paper was to discuss the experimental methods conducted with using different size of aluminum nitride powder to fill the thermal adhesive, the effect of thermal conductivity caused be the method was also evaluated in this paper.There are three main topic in this study: the first part was the stability analysis on T.I.M measuring system. The second one was research and development of the thermal adhesive without hardener. The last part was testing thermal adhesive after adding hardener. Experiment results showed that the test of thermal adhesive were divided to two parts. While testing adhesive without hardener by T.I.M measurement by thermal grease part, hardener added thermal adhesive was measured by T.I.M measurement by K metal part. Before experiment, accuracy of T.I.M measurement thermal grease part was less than 5% by using the Dow Corning TC-5121, and accuracy of T.I.M measurement K metal part was within 10% by using pure copper. It was proved that there were good accuracy and stability in T.I.M measurement equipment. As the thermal grease experiment, epoxy was used as the substrate and mixed with three different sizes of AlN powder, the thermal conductivity could reach 3.66(W/m.K) by mixing 30μm,10μm and 5μm AlN powder with 20wt% Epoxy. After adding hardener, thermal conductivity is 3.09(W/m.K).