Abstract
Abstract In order to reduce the contact thermal resistance between Cooler and CPU surface,and Fill tolerances between parts, the Thermal Interface Material (TIM) was necessary to fill the gap interface and also enhance heat transfer. The main purpose of this paper was to discuss the experimental methods conducted with using different size of aluminum nitride powder to fill the thermal pad, the effect of thermal conductivity caused by the method was also evaluated in this study. This study include three major method: The first part was the stability analysis on T.I.M. measuring system. The second part was research and development of the Thermal Pad, and final part was the Dummy Heater performance testing for the system thermal resistance. In Thermal Pad measurement, the results shown the accuracy error within 10% in thermal conductivity compare with the data provided by T-global Technology Company. Experiment results shown the accuracy error was below 5% for TIM measuring system by using the Dow Corning TC-5121. As for the Thermal Pad experiment, silicone gel was used as the substrate and mixed with appropriate size of aluminum nitride, the thermal conductivity could reach to 3.08 W/m.K. Key words: thermal interface material, thermal conductivity, Thermal Grease, Thermal Pad.