Abstract
AbstractIntermetallic compounds form at the interface of Sn-Cu and Sn-Bi solders on diverse substrates in a relatively short time. However, whether these compounds affect the wetting properties of Sn-Cu and Sn-Bi alloys on diverse substrates remains unknown. Therefore, this study attempts to determine how the intermetallic compounds affect the wetting properties of Sn-Cu and Sn-Bi solders on diverse substrates by using the wetting balance method. A vertical substrate plate is immersed into a molten solder bath. The force performed on the plate is then measured by utilizing a wetting balance. Next, a wetting balance is used to measure the wetting time, wetting force, contact angle and surface tension. Moreover, the operational environment of the wetting balance is altered to obtain discrepant wetting property data under various conditions. Solder temperature, immersion time and solder composition comprise the varying operational environments. Furthermore, OM is used to observe the intermetallic compound at the interface. Experimental results demonstrate the basic wetting properties of Sn-Cu solder on diverse substrates by a wetting balance, such as wetting time, wetting force, contact angle and surface tension. Results in this study clarify the role of reactive wetting in formed intermetallic compounds at the interface by altering the operational environments of the wetting balance.