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以高分子填充技術發展SOI差分電容式剪力感測器
Thesis

以高分子填充技術發展SOI差分電容式剪力感測器

陳政佑
Masters, 國立清華大學, 奈米工程與微系統研究所
2012

Abstract

高分子填充 觸覺剪力感測器
With the progress of medical technology and robotics, the demand of tactile sensor is more and more important. In the application of tactile sensor on robotic fingers, in order to control the size of normal force to avoid the damage by grab the object, we need to detect the shear force caused by sliding between robotic fingers and objects to let robotic finger accurate control the normal force. This study proposes a tactile shear force sensor combined with silicon and PDMS. With combining the SOI wafer and fill-in technique to achieve the device without silicon spring and reduce the influence of normal force to the shear force to complete the tactile shear force sensor. The device’s characteristics are summarized as follows: (1)Using PDMS as device’s dielectric layer can increase dielectric constant and capacitance value. The PDMS also can protect the device form damage. (2)The most important is the design which PDMS can replace the function of silicon spring of modulate stiffness. Changing the mix ratio of PDMS can provide the device different sensitivity and sensing range. (3)Using CNT or Silicon spring as electrical routing.

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