Abstract
Abstract In recent years,the development of the slicing technology with Fixed Diamond Wire Saw is very fast.In order to lower the manufacturing cost of wire saw and to close the kerf loss,it is very important to develpoe the resin-bonded diamond wire saw.During the process of resin-bonded wire saw slicing,most diamond grits are knocked off,so the resinoid diamond wire saw performs way below its potential.In order to gain fine surface quality and high accuracy in industrial requirement more efficiency,so this paper uses Advanced Diamond Wire Saw (ABCD wire saw) to slice Alumina. The advantage of using ABCD wire saw is the ABCD grain have strong retention on the resin matrix, so the Advanced Diamond Wire Saw has great tool life.Further,to analyze saw slicing properties and measure surface roughness, we use SEM to measure chip formation of ceramic materials. These methods can help us to know the brittle fracture mode and ductile regime grinding mode in ceramic materials remove modes. Finally, we control parameters to gain ductile regime grinding mode of slicing ceramic materials. These methods can slice more efficiently and improve surface roughness more excellently. Ductile regime produces thin deteriorate layer and increases requirement of industry.