Abstract
In this study, a CFD model has been developed to interpret and validate the experimental results originating from a concept of enhancing heat dissipation from a substrate with flow inducing openings. Through parametric study as a part of the preliminary research, the practicability and the influence of parameters of this previously unnoticed cooing concept has been discussed. Results indicate that the openings will have a destructive effect on the growth of the boundary layer occurring on the lower surface of the substrate; and hence improve the cooling ability of a configured module without using any additional active heat dissipation measures. More improvement investigations further indicate that the cooling ability of the opening can be augmented through the design rules such as a control of the opening rate to reduce the conduction resistance, an enhancement of net heat transfer ability through a distribution analysis of Nu numbers, etc. Finally, by combining a guide aperture on the shell board and unsymmetrical arrangement design, some adverse phenomena or effects (e.g., the limit of aperture ratio and an obstruct flow within the upper channel) have been obviously improves as found in this study. The concept of opening not only improves 15% in heat dissipation the best original design, but also eliminates some difficulties in finding an appropriate thermal solution such as the manufacturing cost and the design flexibility. Moreover, results show that thermal radiation is an important cooling mechanism as a part of electronic cooling modes, but it is usually overlooked by most researches with an incorrect judgment. A reasonable diagnosis method was also developed in order to verify the issues under investigation. This method would provide future designers with a qualitative understanding of the importance of thermal radiation.