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利用六標準差手法提升封裝廠之晶片切割良率
Thesis

利用六標準差手法提升封裝廠之晶片切割良率

林俊蓮
Masters, 國立清華大學, 工業工程與工程管理學系碩士在職專班
2008

Abstract

六標準差 封裝廠 切割機 迴歸分析 實驗設計 Six Sigma assembly house wafer saw machine regression analysis DOE
In this thesis, a workflow to improve the wafer saw yield of assembly house with the six sigma “DMAIC” is proposed. In “Define”, top managers attend and build up a “Six Sigma” project team to understand the customer’s complaint and analyze the rejected products in the abnormal process flow at the first stage. In “Measure”, the project team aims at the reproducibility and repeatability of measuring machine to come out a good Gage R&R; in addition, they also analyze the current ability of process and set up the target of improvement. In “Analyze”, they use fishbone diagram to list down all the possible factors that could cause the abnormality and use regression analysis to verify the real factors, meanwhile, they also provide the preventive actions to prevent the problem happening again. In “Improve”, project team uses DOE to get the optimal solutions and verify the effectiveness. Finally, in “Control”, project team generates a control plan and provide it to production line for implementing and monitoring the process flow. 6 months past, the production line issue was solved and achieved what customer wished then got about 2 million US dollars effectiveness.

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