Abstract
The semiconductor industry can be divided into front-end wafer fabrication and back-end packaging and testing. The main function of front-end wafer fabrication is to create integrated circuit (IC) on wafer, the representative such as TSMC, UMC, Powerchip are well-known manufacturers in Taiwan. The back-end packaging and testing can be divided into bumping, wafer testing, packaging and testing after packaging. The main function is to package the IC and do electrical testing to get the yield. The drive IC is the key component of TFT_LCD, their packaging and testing manufacturers have entered another Warring States Period from the competing capacity expansion, price war, and vertical and horizontal merging industry in the past, and after the annual campaign of the various warlords, the living environment of the IC package and testing plant is more difficult, a single function manufacturer almost cannot survive and profit in this environment. How to combine different industry with vertical and horizontal cooperation and form a strategic alliance with used competitors, it’s the mutual direction now for all IC packaging and testing manufacturers. They can provide a unified service for customers through the virtual production line platform, in order to achieve: (A) the pursuit of economies of scale (B) the establishment of a full range of services (C) the competitiveness improvement (D) the increase of market share IC packaging and testing plant hope to obtain more orders and market share in this competition, it’s not enough if they still kept the so called Turn_Key_Service (unified service), so the paper constructs an "IC packaging and testing plant turnkey foundry services”, which will combine different industry with vertical and horizontal cooperation and form a strategic alliance with used competitors, through the virtual production line mode of production cooperation to establish the capacity distribution centers. CACC(Capacity_Allocation_Control_Center) model can enable customers to be assured to hand over the wafer after IC_Fab to a complete turnkey services of packaging and testing provider, and achieve the win-win situation of the lowest cost, highest capacity utilization rate, and the maximum profit.