Abstract
This study proposes a sensitivity improving approach for MEMS piezoelectric microphones by using structral design. Compared to exsited commercial microphone constrained by several design limitations, piezoelectric microphones have great potential to achieve higher Signal-to-Noise Ratio. In application, the present design has been implemented on the Silicon-on-Insulator (SOI) wafer. By patterning piezoelectric material, stress distribution in bimorph structure can be improved. Through design different geometry, the sensitivity of piezoelectric microphone can be enhanced 190% from simulation. Reference type microphone design has been measured, and the results can verify the possibility of using piezoelectric platform to fulfill microphone design.