Abstract
A new system of failure analysis for TFT-LCD Source Driver IC is presented. This system is suitable to two package types (TCP and QTCP) of TFT-LCD Source Driver IC. This system consists of a high success rate (94%) de-capsulate technique, a new fixture between device and E-Beam Prober and a powerful/flexible test program. All of above make failure analysis of TFT-LCD Source Driver IC by E-Beam prober linking to VLSI Tester (SC-μ) being successful and practicable. In addition to failure analysis with E-Beam Prober, these new techniques are also useful to other failure analysis tools such as internal probing at probe-station, Emission Microscope for Multi-layer Inspection (EMMI), Optical Beam Induced Resistance Change (OBIRCH), Liquid Crystal (LC), etc. Besides, an Open-Loop method for OP (operation amplifier) is also presented which makes OP analysis become more effective. Hspice simulation is also introduced to help failure analysis in OP. With this system, for TFT-LCD Source Driver IC, failure analysis success rate is promoted and failure analysis cycle time is shortened successfully and effectively.