Abstract
ABSTRACT In order to achieve high current capability and high speed power management and control, multi-phase power conversion advantages are developed. The phase current is up to 25A and the phase switching frequencies ranges from 250KHz to 1MHz. The development of this technique for CPU control is a great breakthrough. However, the challenges of the technique are the high price and the high temperature. As the advances of fabrications, more portable electronic products are used in our daily lifes. The concept of power management is an important assignment for achieving the best quality of products and saving power, and the indispensable protected circuit is worthy to be investigated especially. The topics of this research are aimed at input under voltage protection circuit, over-temperature protection circuit, and over-current protection circuit. The power IC industry is expanding quickly in recent years, and the power industry is the major contribution to growths of domestic and overseas market. The power management and control chips can be separated into three items, which are control model, driver model, and protection model. The structure of chips is not alike from different companies, so the power management and control chips may be composed of these three or several previous items. This paper is focused on the design of protection model. The simulations and layouts of this chip named “the input UV circuit and temperature sensor for high-speed current power management controller” are fabricated with 0.35 μm 2P4M Mixed Signal technology provided by TSMC, and the chip is packaged by 18SB technology. This chip whose size is 0.401*0.67 mm2 has 1.57 mW power loss and maximum 1 MHz frequency, and it can work normally verified from practical test.