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化學機械拋光中拋光墊特性與損耗關係之研究
Thesis

化學機械拋光中拋光墊特性與損耗關係之研究

徐任賢
Masters, 國立清華大學, 動力機械工程學系
2000

Abstract

機械化學拋光 拋光墊 壓縮性
Pad, consumable product of CMP is one of most important factor in the polishing process. Until now, pad is dependent on import. No domestic manufacturer has this technology and nobody really understand the characteristics of pad. All of the pad information, like the compressibility, pad life rely on the foreign manufacturer. There is no any acknowledged standard or instrument to check pad’s quality. with the polish time(wear) by modeling and experiments. The trend of K for single pad and composite pad follows the wear of pad is exactly opposite. In spite of this, the variation of K follows wear is regular. So, theoretically, it’s practicable that use compressibility as the standard to diagnose if pad is good for polishing. Then, we cooperate with the ASIA Microprocess, INC. to develop a instrument can measure K on-line, and establish some useful This present study found the variation of compressibility(K) of two types of the major pad(single layer pad and composite pad) standard. The instrument(K-meter) will help people to judge the state of the CMP pad more reasonable and easily.

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