Abstract
Abstract Technology developments come from the real life requirements. Various types of electronic goods, such as mobile phones, televisions, tablet PCs, are indispensable in the public life recently. As an important part of electronic products, the display develops toward multi-color, high-speed, rapid response and low energy consumption trend. Product life cycle in display industry becomes shorter and shorter while sales price getting lower and lower. Facing costs decreasing year by year in trendency, how to improve the efficiency of the foundry and control gross margin to cope with industrial development trends has been a new critical issue for back-end IC test foundries. In this paper, to solve the main consumables acqusition problem of the probe card for wafer testing, a probe card acqusition decision-making framework is constructed based on the UNISON decision-making framework by using the influence graph and the decision tree method. Besides, risk profile and sensitivity analysis are used to obtain the mode of choice for probe card supplies to make decision in practical problem. To test the validity of the research structure, this study takes a Taiwan semiconductor wafer test company as a case. All the discarded probe cards are obtained from the foundry source and the specific customer model. Based on the decision hierarchy analysis method, the proposed model is established to analyze probe card acquisition decision problem and serves as a reference for decision makers. Meanwhile, refer to success rate of the sensitivity of graph analysis, decision maker can aquire the implementation of future decision with average efficiency of the probe card production decision-making estimates. The empirical results show that this study is effective and feasible. Its analytical practices and methods can also be a basis of reference flow and architecture.provide for other decision-making issues related to material acquisition.