Abstract
As the semiconductor process progresses continuously to smaller critical dimensions, all electronic devices are able to develop toward ever lighter, thinner, shorter and smaller, also with high frequency, high speed and multi-function capabilities. To the Printed Circuit Board, which acts as both the carrier and circuit connectr of these components, it means thinner substrate, finer circuit lines and more accuracte registration are required. To the exposure technology, which is responsible for the image transfer of thess pattens, it has encountered a paradigm shift. There are several developing technologies that are feasible to meet the specification requirement of the next generation exposure. They include the Projection Step & Repeat Exposure, the Laser Direct Imaging, the DMD Direct Imaging and the Laser Projection Imaging. Firstly, the main processes of the multi-layer Printed Circuit Board and the High Density Interconnect Board were analyzed in this study. The development history of the exposure technology and its limitation during processes were then explained. The competiting advanced image transfer technologies were then analyzed and compared. Suggestions to possible selections were made to material suppliers, equipment suppliers as well as printed circuit board manufacturers at the end of this study.