Abstract
Recently the techniques of applying microtransducers on the biomedical microsystems, such as Cochlear and artificial retina, have become more and more noticeable and well-developed. Yet the fabrication process of transforming the microtransducers into biocompatible flexible devices has not been well-studied. Therefore, we developed a fabrication technique that could generally apply to various of microtransducers. In this research, a novel fabrication process for making biocompatible flexible integrated circuits is presented. By utilizing lapping, etched, deposition Parylene C, we are able to transform electronic devices and microtransducers into flexible and biocompatible devices. In this work, CMOS transistors were fabricated using 0.18 μm technology on an 8-inch SOI (silicon on insulator) wafer。By the wafer back grinding technique and the repeated Parylene C deposition, we constructed 30μm-thick flexible sandwich structure of CMOS transducers from the original thickness of 700 μm. The implantable flexible CMOS transducers are then measured by a Semiconductor Parameter Analyzer HP4156C. The characteristic curves and threshold voltages are shown to have mere small variation before and after this fabrication technique.