Abstract
The study is to observe, validate and evaluate the impact of new personnel to improve the affection of wafer visual inspection by training time and process. Under actual environmental conditions, plans the microscope wafer measurement by the distinction of work experience and increase the inspection time. Control the actual standard inspection time to 15 to 20 minutes by each batch, in the repetition of 15 minutes teaching and repeat for 30 minutes teaching (15 minutes/batch→rest interval 5 minutes→15 minutes/batch). The items include the chip image judgment and image recognition techniques. Collect the measure image data accuracy as reference to the basic training time for new operator. The results shows that under repetition 30 minutes training by actual wafer verification, the new staff can really improve the accuracy as staff with experience, even the repetition of 15 minutes training also have a slight improvement. The potential impact on the judgment of inspection is the difference of customized wafer special image. In future, the training could plan to increase the specificity of different chips, and regular training as a continuous learning curve to improve memory.