Abstract
Epoxy is widely used in packaging, coating and so on. However, both the form of epoxy resin construction is use of (two liquid type) epoxy resin and hardener in accordance with chemical structural epoxy equivalent and hardener appropriate proportion, after the construction of mixed hardening. Curing speed of epoxy depends on the properties of epoxy resin and curing agent in the reaction of nature, in particular epoxy and harder to control the correct usage is often the most critical steps are not sure, especially in equipment and construction site human factors can’t fully grasp, which is the problems that two liquid type epoxy resin often faced. In this thesis, experiments using self-assembly phase separation, by epoxy resin and hardener (amine) doses of imbalance, the hardening agent is packaged in the micro-capsule that diameter about 8μm, then mixed the microcapsules and the conductive polymer powder or metal powder in the unreacted epoxy. When the epoxy is heated, the microcapsules will rupture, at the same time release the hardener (amine) inside the microcapsules, after that the epoxy and hardener will crosslinking. In addition, by adding the conducting polymer powder or metal powder that epoxy resin insulation properties will change to conductive. The results showed that adding different chemical structure of epoxy can make microcapsules have more complete properties of package. An appropriate proportion of the curing agent can also reduce the residue on the microcapsule surface, so that a single liquid type epoxy resin can be stored longer. In order to let epoxy resin have the properties of thermal conducting, metal powder (Al) conductive polymer were respectively added in to the epoxy resin. After the conducting material was added, the epoxy resin conducting capability was obviously promoted. On the other hand the experimental data is also clarify that if doped the same weight of conductive filler, doped conductive polymer has better thermal conductivity performance than the doped metal powder.