Abstract
By finite element simulation and experiments, this work focuses its attention on the thermal dissipation efficiency analysis for a Thin Quad Flat Package (TQFP) under a natural convection environment based on JEDEC (Joint Electron Device Engineering Council) specifications. To accurately account for the convection and radiation effects, the surface temperatures of the TQFP welded on the test board are first measured by the infrared (IR) thermometer and considered as the boundary conditions of the finite element calculation using the ANSYS program. To modify and establish a reliable finite element analysis model, the computed results are verified by the thermal test die measurement. By this model established, various heat transfer models developed in the literature are then evaluated. After selecting the most appropriate heat transfer model as the boundary conditions, this work further assesses the ratio of the thermal dissipation from each heat transfer path. Finally, the parameter analysis of the major thermal dissipation components and related thermal stress analysis are performed. The results could be used as a guideline for TQFP’s thermal dissipation management and reliability analysis.