Abstract
In recent years, intensive efforts in the development of direct metallization techniques for micro-fabrication have taken place as a result of the convergence of different fields of science and technology. A mask-less fabrication process has been developed on the other hand. The designed micro patterns are written on the specimen by laser guiding to build or repair micro structure rapidly rather than using the mask fabrication process requiring long lead time. We have studied the feasibility of laser-assisted copper deposition on copper substrate using Thiobacillus ferroxidants metabolite as working medium with a 1064nm Nd:YAG laser to form desired patterns, and found there is a positive correlation between the deposition amount and the laser power, scan repetitions and reciprocal of scanning speed, respectively. To expand the application, substrate replacement is in need. The choice of the substrate is mainly determined by the application domain and includes polyimide, Si and SiO2. 532nm laser source is set up to find the effect of wavelength on the deposition lines. Compare to other substrates, SiO2 showed better performance of deposition continuity. After changing the substrate, both etching time and sediment from etching reaction would affect the composition of the deposition line. Moreover, there were less energy consumption and better deposition results by changing laser source from 1064nm to 532nm.