Logo image
堆疊前中介層之非接觸式晶片測試
Thesis

堆疊前中介層之非接觸式晶片測試

徐瑞祥
Masters, 國立清華大學, 資訊工程學系
2013

Abstract

堆疊式晶片 中介層 測試 熱影像 Stacked-die Interposer Testing Thermal image
A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%.

Metrics

1 Record Views

Details

Logo image