Abstract
In recent years, the electronic equipment goes toward to little size and constantly improves on high efficiency. However, to microminiaturize and densify the electronic device / chip will lead to the result of increasing heat capacity transition. Therefore, the demand of heat dissipation increases fast, so it makes the electronic heat dissipation device become more important and furthermore develops a variety of functions/forms heat dissipation. Temperature is one of the reasons, taking 55% of them, to cause the electronic device damage. In nowadays, the technology of the heat dissipation is no longer suitable for small-size electronic products because of the limitation on size/volume, noise-reduction and power efficiency. Piezoelectric fan is a new design about a concept of heat dissipation to be used in the heat dissipation application of notebooks or cell phones. Comparing with a traditional electric fan, there are three advantages: small volume, less power consumption and noise-reduction; In other words, these advantages are quite suitable for the demand of the electronic element in heat dissipation which requests low power, low noise and microminiature. Piezoelectric fan takes advantage of the characteristic of piezoelectric effect which will trigger the blade to turbulence the air for cooling down the heat/temperature of electric device. The research of this essay subjects to the materials of Piezoelectric fan--Piezoelectric parameter d33, the thickness of fan blade, the differential of Bonding Glue to effect piezoelectric performance, and the result of heat/thermal dissipation from pin fan.