Abstract
In these few years, the properties of LED (Light Emitting Diode) such as efficiency, brightness, and service life were improved dramatically. The scale of LED market continually increased. The illuminating gradually becomes an important application of LED. Hence, HB (High bright) LED becomes a very important research topic. To reach high bright and energy efficiency performance, the HP (High power) LED package must be used, the use of regular LED not only decrease the energy efficiency, but also increase the encapsulates temperature. The reason for that is due to the light comes from LED chip transform into heat by refraction and reflection. There are four key compositions of LED, which including the geometry of plastic lens, the angle of reflector cup, the depth of reflector cup, and the reflectance of reflector cup. Those factors determine the efficiency of the LED. Therefore, to find the better packing configuration, in this study, color mixing problem on multi-chip high power LED was optimized by Taguchi method. Finally, optimum package composition for multi-chip high power LED is presented.