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封裝材料在不同溫度之下的靜態和潛變行為
Thesis

封裝材料在不同溫度之下的靜態和潛變行為

王閔生
Masters, National Tsing Hua University
2001

Abstract

聚亞醯胺樹脂頸縮夾持板潛變破壞 polyimideneckingend tapcreeprupture
The research based on BT material and polyimide material under defferent strain rate test.And use two materials to enforce tensile test in different temperature.Final,use polyimide material enforce creep test.Use 10e-2、10e-3 and 10e-4 strain rate to enforce tensile test,when strain rate faster,the strength is stronger.But polyimide material,when strain rate slower,tensile rupture is higher,because the necking behavior happen.Consider two material,it's mechanical properties under different temperature.Use five temperature,each temperatue is -40°C,25°C,75 °C ,125°C及150°C。Final,consider polyimide material,observe creep behavior under this material,because creep not obvious uder lower temperature,we don't consider it.Use 25°C,75 °C ,125°C及150°C to enforce creep test,use different experiment,hope can find creep mathmatical model.

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