Abstract
Abstract In order to reduce the thermal resistance contact from thermal modules and heat source, we need to use thermal interface material (Thermal Interface Material, TIM) to effectively remove the heat which is generated by the CPU and achieve the purpose of cooling. Developed in our laboratory, we establish a measurment system for the measurment of thermal interface materials. This system can accurately measure the properties of thermal interface materials. The main purpose of this paper is to gauge and analyze the thermal conductivity of thermal pad and insulation materials by using the TIM measurment system. Thermal conductivity analysis of insulation materials must be a very important basis of energy engineering in the future. The results can be found in the following experiments. The relative error of thermal conductivity’s repeatability were less than 1% when measuring Thermal Grease ( using Dow Coning TC-5121 and Shin-Etsu 7762 ) by TIM measurement system. When measuring 15 kinds of Thermal Pad’s thermal conductivity ( using 14 kinds of samples from the SAINT-GOBAIN Advanced Materials (Taiwan) Co.,Ltd and one from the TSC ).We can found that the relative error of repeatability and reproducibility were below 10%. As mentioned above, TIM measurement system has high stability and accuracy. Therefore, we use TIM measurement system to gauge and analyze the thermal conductivity of insulation materials. Measure and compare some materials, such as bakelite and teflon, which their thermal conductivity properties had been known. The experimental results shows that we control the thickness of insulation material below 1.5mm, the relative error of thermal conductivity which was gauged by the TIM measurement system, and the theoretical value will less than 10%. These results also indicated that this TIM measurement system have high stability and accuracy in measureing Thermal Pad and insulation materials.