Abstract
Engineering change is a very important task in the high tech industry. All stages of product life cycle maybe have engineering change requirements, no matter what development, production and even product is delivered to customer. As semiconductor manufacturing process complexity and diversity of products, any process change will be a slight move in one part may affect the whole situation. Thus, there will be existence of risks with engineering change activities and then those risks may cause yield loss, lower quality and increase reliability concerns or lead to a large number of scrapped products from severe condition. Therefore, engineering change must have whole evaluation of methods and operation of procedures as well as implementation of engineering change management with effective electronic systems.The research towards to knowledge management, standardization and engineering change management fields integration, by means of both re-design in procedure and engineering change management system methods. And through the actual interviews to achieve comparison in difference of engineering changes from semiconductor manufacturing operations to help improvement in semiconductor manufacturing engineering change management, and then to increase business competition-ability.The paper consist of engineering change flow plan, system development and design considerations as well as management modes that can act reference in engineering change management of both technology industry and other industries. Furthermore, the research satisfies operation in coordination with actual requirement from their company as well, I believe that readers can obtain constructive information and suggestions.