Abstract
Abstract Wafer, the substrate of integrated circuit (IC), decides the quality of final product performance from its intrinsic properties. Currently, most semiconductor manufacturing FABs use COA (Certificate of Authenticity) as accepted criteria to wafer suppliers. During the more complicated and advanced technology going, the raw wafers with same COA perform different results after hundreds of manufacturing and thermal process. The unpredictable failure reveals the deficiency of overall optimized certification for raw wafers. This study aims to employ UNISON decision framework to develop a raw wafer quality management system for reducing advanced/special process developing period on semiconductor manufacturing. For mature products, here demonstrates an optimized procedure for wafer CoA key parameters improvement. This can very help to accurate the right root cause and fix problems in a short time. Also, for specialty and advanced products, this study finds the most related wafer parameters from historic experience with DOE analysis and significantly reduces developing cycle and useless guess.