Abstract
Cooler is an important element for many power devices and chips which will generate large thermal energy. Lower the temperature of electrical devices not only making the device life time longer, but also maintaining the properties of devices within the design specifications. The active coolers which have the advantages of precise control and longer life time can be fabricated using the thermoelectric effects of materials. Moreover, we can change the direction of current to make cooling becoming heating if needed. This thesis presents the fabrication of integrated thermoelectric cooler which can cool small and specific area using surface micromachining technology. We have improved the integrated TE cooler by using bridge structure to reduce the undesired thermal conductivity. A test structure that will facilitate the measurement of the efficiency of TE cooler is also designed and fabricated.