Abstract
As to high-competitive electronic industry, the inspection of follow-up process not only enhances production yield but also reduces the waste of manufacture at failure. At present, traditional two-dimension automatic optical inspection machine is already useless under the tendencies of Pb-free manufacturing process and higher component density. Therefore image processing that can rebuild the three-dimensional structure show up prominently gradually. This research simulation adopts the X-ray Laminography to measure, value the demand that the high-speed operation of this method can relatively accord with the inspection of the electronic product mainly. The object is to study effects of some system parameters on the reconstruction quality. The system parameters studied include the kinematical type of the system, number of synthesized image and the projection angle. It expects that the measuring of the sample is able to be found the inside flaw or the defect is existing or not.