Abstract
The main purpose of this paper is to employ Six Sigma DMAIC and Taguchi methods to improve upon poor yield and product reliability issues common to the Bumping process. Poor yields and low reliability have led to customer dissatisfaction, inability to breakthrough technical bottlenecks, being overtaken by market competitors, losing market shares as well as increasing production costs. This investigation has thus standardized the improvement procedures taken in response to poor quality performance in order to mitigate negative factors affecting company growth such as cost of poor quality, loss of customers, and stagnation of technical capacities. Results of this investigation shall provide research and development units of IC assembly and test companies with a reference and basis for a systematic approach on overcoming poor product design and quality. Finally, after employing the improvements proposed in this investigation, a specified target company was able to meet their specified deadlines and even achieve their goals 3 days ahead of schedule, improve yield by 11.84%, increase average monthly revenue by NT$ 33 million, and improve process capability by more than 1 sigma.