Abstract
Packaging of a Micro-Electron-Mechanical System (MEMS) is a key technology for MEMS. With an imperative need of High-Aspect-Ratio microstructures, SOI-MEMS technology is rapidly used because of its process simplicity and robust structures. But packaging of a SOI-MEMS wafer was rarely investigated. The main reason is that the interconnection which is been used in SOI-MEMS wafer have a step height of at least dozens of micrometers. None of existing MEMS packaging technologies can seal this range of step height without failed. This thesis bring up a SOI-MEMS packaging solution with through-wafer interconnections and anodic bonding with Pyrex 7740 glass. Taking advantage of through-wafer interconnections, electrical signals can input from backside of wafer, which is compatible with existing Surface Mount Technology. With anodic bonding of single-crystalline silicon and Pyrex 7740 glass, we can achieve high bonding strength and hermetic seal. Whole packaging process accomplishes at wafer-level, which represent lower cost and best post-process compatibility.